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PACDN1404
APPLICATION INFORMATION
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance ? Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183 ? C)
Maximum Soldering Temperature for Lead ? free Devices Using a Lead ? free Solder Paste
Value
0.240 mm
Round
Non ? Solder Mask Defined Pads
0.290 mm Round
0.125 mm ? 0.150 mm
0.300 mm Round
50/50 by Volume
No Clean
OSP (Entek Cu Plus 106A)
? 50 m m
? 20 m m
60 seconds
260 ? C
Non ? Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 1. Recommended Non ? Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0 3:00.0
4:00.0
Time (minutes)
Figure 2. Lead ? free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
3
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